Head of Mechanical Design

It's fun to work in a company where people truly BELIEVE in what they're doing! We're committed to bringing passion and customer focus to the business. If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us! Job Summary We are seeking an experienced Mechanical/Packaging Design Manager to lead the mechanical and packaging design for our next-generation 1.6T client-side optical transceivers. The ideal candidate will have a strong background in high-speed optical module packaging, thermal management, and Chip-on-Board (COB) assembly processes. This role requires deep expertise in optical coupling, die bonding, wire bonding, and precision alignment techniques, ensuring high-performance, manufacturable, and reliable optical modules. The candidate will work closely with optical, electrical, and manufacturing teams to optimize module performance, manufacturability, and cost efficiency. Key Responsibilities 🔹 Mechanical & Packaging Design for High-Speed Optical Modules Lead the mechanical and packaging design for 1.6T optical modules. Optimize module housing, PCB layout integration, and thermal dissipation strategies. Ensure designs meet industry standards (MSA, IEEE, Telcordia, etc.) and customer requirements. 🔹 Advanced module Packaging & Assembly Design and develop optical module packaging for high-speed interconnects. Work on die bonding (DB), wire bonding (WB), and optical coupling (fiber, lens, and mirror integration). Develop precision assembly and alignment techniques to ensure high optical coupling efficiency. Collaborate with process engineers to optimize epoxy dispensing, underfill, and encapsulation. 🔹 Thermal Management & Reliability Engineering Develop thermal solutions (heat sinks, vapor chambers, TIMs, and metal housings) to optimize heat dissipation. Conduct thermal simulations (ANSYS, FloTHERM, Icepak) to ensure module reliability. Improve module mechanical robustness, shock/vibration resistance, and long-term stability. 🔹 Process Optimization & DFM/DFA Work with manufacturing and contract manufacturers (CMs) to ensure high-yield, cost-effective production. Improve DFM (Design for Manufacturability) and DFA (Design for Assembly). Develop process flow and standard operating procedures (SOPs) for packaging and assembly. 🔹 Cross-Functional Collaboration & Project Leadership Coordinate with optical, electrical, and test engineers to optimize module performance. Interface with suppliers and assembly partners to improve material selection and process quality. Mentor junior engineers and contribute to design reviews, failure analysis, and continuous improvement. Required Qualifications 🔹Education & Experience: Bachelor’s or Master’s degree in Mechanical Engineering, Packaging Engineering, Optical Engineering, or a related field. 5+ years of experience in mechanical design and packaging for optical transceivers or semiconductor components. Prior experience in 800G/400G client-side optical modules or similar high-speed optical interconnects is highly preferred. 🔹Technical Skills: Proficiency in mechanical CAD software (SolidWorks, AutoCAD, etc.). Strong experience in thermal management techniques and simulation tools (ANSYS, FloTHERM, Icepak, etc.). Deep understanding of module assembly, including die bonding (epoxy or eutectic), wire bonding (gold, aluminum), and optical alignment. Knowledge of optical coupling techniques (active/passive alignment, lens design, fiber attachment). Experience in precision machining, CNC, die-casting, and injection molding for high-speed modules. 🔹Soft Skills & Other Requirements: Strong analytical and problem-solving skills. Ability to collaborate with cross-functional teams (optical, electrical, process engineers, and manufacturers). Fluent in English (Mandarin is a plus, depending on location and suppliers). Experience with MSA (Multi-Source Agreement) compliance for optical transceivers is a plus. #AI # Optics